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v.电沉积
n.电沉淀物
1、valence electrons periodic table───价电子周期表
2、electro-magnetic prod───电磁棒
3、electro swing───电动摆动
4、electrolytic separator───电解分离器
5、yttrium electron configuration───钇电子组态
6、electron capturer───[医]电子俘获器
7、electrodermal skin response───皮肤电反应
8、electrolyzation of h2o───水电解
9、electronic games───电子游戏
10、electrolyzed oxygenated water───电解氧化水
1、Chromium electrodeposit with high hardness, wearability, corrosion resistance and distinctive appearance was widely applied in electroplating sector.───铬层具有高硬度、耐磨、耐蚀和独特的外观，在电镀行业中应用广泛。
2、Study of amorphous iron-chromium alloy electrodeposit───非晶态铁铬合金镀层的研究
3、and applying an electrical current to electrodeposit the deposit on the substrate.───并提供电流以在基底上电沉积所述沉积层。
4、Properties and preparing process of tri layer films with Ag base coating, Ni electrodeposit, Sn Pb alloy for terminal electrode of multilayer chip inductor were described.───介绍了叠层片式电感三层端头电极即银基底电极、镍层、锡-铅合金镀层的性能及制备工艺。
5、Effect of Small Amount of Lead on the Texture and the Surface Properties of Zinc Electrodeposit───微量铅对电镀锌层织构及表面特性的影响
6、This system can deal with the difficulty of image processing and detection aroused by strong reflection of electrodeposit surface and meet the demand of practice manufacture.───该XiTong有效的解决了电镀工件表面的强反射光给图像处理和检测带来的困难，适于生产现场自动检测应用。
7、Application Study of Nano-Nickel Coating Produced by Pulse Electrodeposit in Manufacture of Diamond Tool───脉冲电沉积纳米晶镍在金刚石工具制造中的应用研究
8、The article discusses the dimension control mechanism of ultra - fine copper powder in the preparation of electrodeposit .───本文探讨了电沉积过程中超细铜粉的粒径控制机制。
9、In making qishan copper coating base roll before you have to deposit its pre-electrodeposit.───在制息制版铜层之前，基辊都给沉积预镀层，其办法纷歧而脚。
1、Overlapping method applies out electric field to electrodeposit, and uses the insulation layer to prevent the crystal particle between the layers from growing.
2、Anionic electrodeposit coating line for aluminum shell of solar water heater is introduced. Anodic oxidation, anodizing electrolytic coloring and anionic electrodeposit coating process are focused.
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4、Properties and preparing process of tri layer films with Ag base coating, Ni electrodeposit, Sn Pb alloy for terminal electrode of multilayer chip inductor were described.
5、Chromium electrodeposit with high hardness, wearability, corrosion resistance and distinctive appearance was widely applied in electroplating sector.
6、Cobalt - tungsten electrodeposit as copper barrier was presented in the paper.
7、The internal stress of electrodeposit is one of the important factors of affecting electroplatingQuality.
8、This system can deal with the difficulty of image processing and detection aroused by strong reflection of electrodeposit surface and meet the demand of practice manufacture.
9、By decreasing the current density in plating process, the width and depth of cracks of the electrodeposit are reduced and the corrosion resistance of the electrodeposit improves.