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[电子]芯片尺寸;电路片尺寸
1、chip gaines───奇普·盖恩斯
2、said chip───奇普说
3、size───adj.一定尺寸的;n.大小;尺寸;vi.可比拟;vt.依大小排列
4、chip shot───打高球;近穴击球;削球;n.[体]近穴击球
5、crisper chip───脆片
6、chip ingram───芯片ingram
7、potato chip───n.炸土豆片
8、chip dale───奇普戴尔
9、computer chip───电脑芯片
1、in terms of chip size , it s actually smaller than merced , and yet it s in the same process───在芯片大小方面,它实际上比merced小,而采用的是同样的加工工艺。
2、Ultrathin Wafer Level Chip Size Package Technology───超薄型圆片级芯片尺寸封装技术
3、Wafer Level Chip Size Package Technology and its Applications───晶圆级芯片尺寸封装技术及其应用
4、Semiconductor device, semiconductor wafer, chip size package, and methods of manufacturing and inspection therefor.───半导体器件,半导体晶片,芯片尺寸封装及制作和检测方法。
5、By using helix -stacked inductors, an acceptable quality factor and self-resonate frequency are achieved with a smaller chip size.───我们利用了螺旋堆叠式电感在较小的晶片面积下达成效能可接受的品质因数及自我共振频率。
6、This wafer level chip size package (WL-CSP) process encases the die in a solid die-size glass shell.───圆片级芯片尺寸封装 (W L C S P)工艺是在固态芯片尺寸玻璃外壳中装入芯片。
7、The emphasis on minimizing cost, complexity and chip size is permeating all aspects of the standardization process.───在此标准化过程的方方面面都贯穿着对降低成本、复杂度和芯片尺寸的强调。
8、Primary Thickness Screening Efficiency and Chip Size Distribution───木片厚度筛选及尺寸分布
1、The expected productivity increase by shrinking the chip size combined with the use of 300mm wafers is the basis for a significant reduction of production cost per chip.
2、Therefore, the metal oxide semiconductor can be used efficiently without additional manufacturing of a capacitor, and can save the chip size so as to reduce the cost.
3、To reduce the power dissipation and chip size of digital calibration circuits of pipelined analog-to-digital converter(ADC), a new statistics-based background calibration technique is presented.
4、The chip size is prevented from increasing, and temperature dependence of a MOS transistor is compensated for while the power consumption is kept from increasing.
5、The chip size distribution from mechanical screening and optical scanning gives variable results.