大家都搜：
[电子]电子封装
电子组装
1、electronic mailbox───电子信箱；电子邮箱
2、electronic engineering───n.电子工程学
3、electronic machinery───电子机械
4、blister packaging───起泡包装; 水泡型包装；泡罩包装；硬质泡沫塑料衬垫包装
5、aseptic packaging───无菌包装
6、electronic spreadsheet───电子表单
7、fibreform packaging───纤维形式包装
8、electronic library───电子图书馆
9、electronic balance───[计量]电子天平
1、The increase of chip integration and packaging density has set higher demands on properties of electronic packaging materials.───芯片集成度的增加及封装密度的增大都对电子封装材料的性能提出了更高的要求。
2、With the change of material and technics in electronic packaging, it brings the problem of solder joint reliability.───由于封装材料与封装工艺的改变，给焊点可靠性带来了一系列相关问题。
3、The example of electronic packaging problem demonstrates that the proposed method is available and efficient.───电子封装问题的多学科协同满意优化实例表明该方法是行之有效的。
4、In this paper, new progress of electronic packaging technology is presented.───本文综述了电子封装技术的最新进展。
5、Flip chip technology has become one of the major joining technologies in electronic packaging.───摘要覆晶技术已成为电子构装中之主要接合技术之一。
6、To apply ceramic to electronic packaging substrate material depends on improvements of its micro-machining properties.───陶瓷用于电子封装基片材料，有赖于对其微细加工性能进行改善。
7、Strong fundamental in the fields of electronic packaging related mechanics and material science.───在封装相关的机械和材料方面基础知识扎实；
8、The contents of nano electronic packaging, as well as its status and developing trend are described.───阐述了纳电子封装的研究内容和纳电子封装的现状及发展趋势。