大家都搜:
粘接温度
1、bonding time───粘结时间
2、temperature───n.温度;体温;气温;发烧
3、ionic bonding───离子键;离子键结;离子结合
4、metallic bonding───金属键;金属结合剂;[物]金属键合
5、atomic bonding───[化学]原子键
6、covalent bonding───共价键合;共价键;共价键结;共价结合
7、bonding process───粘结法;黏结法
8、baby bonding───小面额债券(票面百元以下)
9、bonding───v.黏合;建立关系;把(货物)存入关栈中(bond的现在分词);n.人与人之间的关系;键合;粘合
1、Techniques for Lowering The Bonding Temperature in Ceramic to Ceramic or Metal Bonding Research───降低陶瓷与陶瓷或金属连接温度的技术
2、The microhardness of the joints increases with increasing of bonding temperature, but it shows a peak value as the bonding time is prolonged.───接头显微硬度随连接温度的升高而明显提高,但随连接时间的变化存在峰值。
3、bonding process parameters: bonding temperature, bonding pressure, bonding time;───焊接工艺参数:粘接温度,焊接压力,焊接时间;
4、When bonding temperature was 1403 K, reaction layer grew fast at first and then slow down with the increase of bonding time.───在连接温度为1403 K的条件下,随着连接时间的增加,界面反应层厚度先快速增加,再缓慢增加。
5、Bonding temperature, bonding time and interlayer thickness have an obvious effect on the shear strength of the joints.───连接温度、连接时间和中间层厚度对接头抗剪强度具有较明显的影响。