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[电子]硅片
1、silicon dioxide───[无化]二氧化硅；n.二氧化硅
2、silicon───n.[化学]硅；硅元素
3、sapphire wafer───蓝宝石晶片
4、wafer───n.(Wafer)人名；(英)韦弗；n.圆片，晶片；薄片，干胶片；薄饼；圣饼；vt.用干胶片封
5、wafer notch───晶圆缺口
6、wafer mapping───[电子]晶片图；晶片图形布置
7、silicon valley───硅谷（美国一高科技区名）
8、wafer no───晶圆编号
9、dummy wafer───假片
1、Making integrated circuits involves depositing layers of materials such as semiconductors and metals on a silicon wafer.───制造集成电路需要将如半导体和金属等多层材料放置在硅片上。
2、The new device is a silicon wafer about the shape and size of a playing card.───这个新设备是一张纸牌大小的硅晶片。
3、The surface grinding temperature of the silicon wafer ground by diamond wheels is studied.───研究金刚石砂轮磨削单晶硅片时的表面磨削温度。
4、disruption in silicon wafer production can then stall makers of memory chips and, ultimately, consumer products.───硅晶片生产的中断会使内存芯片的生产停顿，并最终会影响到消费产品。
5、Contamination Particulate - Particles found on the surface of a silicon wafer.───沾污颗粒-晶圆片表面上的颗粒。
6、I went into a clean room with a fresh silicon wafer, and then I just cranked away at all the big machines for about 100 hours.───我在无菌室Cao作一片硅晶片，接着我周转于所有这些大型机器中大约100个小时。
7、The differential microphone is formed using silicon fabrication techniques applied only to a single, front face of a silicon wafer.───该差动式传声器是通过将硅制造技术仅应用到硅片的一个单独的前面上而形成的。
8、The final Ic is made by sequentially transferring the features from each mask, level by level, to the surface of the silicon wafer.───按照顺序从每一块掩膜版上将图形一层一层地转移到硅片的表面，就制得了成品集成电路。
9、Chip: The individual circuit or component of a silicon wafer, the leadless form of an electronic component.───芯片：单回路或元件的硅晶元，无引脚的电子元件。
1、Mechanical Test Wafer - A silicon wafer used for testing purposes.
2、The microscope comprises a silicon wafer filter membrane which is highly- planar and does not fluoresce.
3、This accelerometer is fabricated by N type silicon wafer. To obtain high aspect ratio structure, deep reactive ion etching(DRIE) process is employed.
4、A silicon wafer bonding technology and its application to new dielectric isolation combined with conventional V-shaped grooves are described.
5、In this work, RAFT grafting polymerizations from silicon wafer were investigated.
6、Hot plate with silicon wafer in initial configuration ( before heating ).
7、Hot plate with silicon wafer lowered to heating position.
8、In the thesis, the fabrication processes is compatible with SOI and ordinary silicon wafer, dielectric mirror and metal mirror.
9、Li is China's largest electronic silicon and silicon wafer manufacturing company.