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铅锡共晶软焊料
1、solder irons───烙铁;电烙铁
2、solder paste───焊膏;[机]焊锡膏
3、solder mask───焊接掩模;焊接淹模;阻焊层; 焊接掩模,焊接淹模
4、solder wick───锡线
5、fluxed solder───焊剂;熔剂
6、solder pot───焊锡炉
7、solder flux───焊剂;热焊接溶剂
8、jewelers solder───珠宝商焊料
9、solder gun───[电] 电焊枪
1、The shear strength of BGA joint with eutectic solder is higher than that of tin-lead alloy itself.───共晶钎料BGA球焊点的抗剪强度比锡铅合金钎料自身的抗剪强度大。
2、Choi S. Lee J. Guo F Creep properties of eutectic SnAg solder and Sn- Ag composite solders containing intermetallic particles.───史耀武。闫焉服。刘建萍金属颗粒增强的锡铅基复合钎料及其制备方法。
3、Effect of Barrier of Thin-film Metallized LTCC Substrates on Eutectic Solder───薄膜金属化低温共烧陶瓷基板的阻碍层对共晶焊的影响
4、Using a co-electroplating process, it was possible to plate the Au–Sn solder directly onto a wafer at or near the eutectic composition from a single solution.───通过这个电镀共沉积的过程,我们有可能用一种单一的方法将金锡合金固体焊料直接镀在晶片上的低共熔点上或其附近。
5、Effectiveness of Barrier Metals of the Thin-film Metalized LTCC Substrates for Eutectic Solder Bumps───薄膜金属化LTCC基板的薄膜阻碍层对共晶焊的影响