大家都搜：
锡球；焊锡球；锡珠
1、solder mask───焊接掩模；焊接淹模；阻焊层; 焊接掩模，焊接淹模
2、solder gun───[电] 电焊枪
3、solder flux───焊剂；热焊接溶剂
4、solder paste───焊膏；[机]焊锡膏
5、fluxed solder───焊剂；熔剂
6、solder irons───烙铁；电烙铁
7、solder wick───锡线
8、jewelers solder───珠宝商焊料
9、solder pot───焊锡炉
1、EPBGA model consists of seven parts, they are heat spreader, molding compound, chip, substrate, thermal vias , solder ball and PCB board.───EPBGA构装体由七个部分所组成，分别为散热板、成形树脂、晶片、基板、热通孔、锡球及印刷电路板。
2、The maximum cumulative equivalent creep strain was located in inner solder ball and at the edge of silicon chip.───最大累积等效蠕变应变位于内层焊点，且在芯片边缘。
3、For example of solder ball, flux residues, clamping marks.───如锡珠，助焊剂痕迹，夹抓纹之清理。
4、Melt the solder ball to remove the BGA.───使焊球熔化以取下芯片。
5、paper we report the analysis of underfill encapsulation between the solder ball, micro-chip...───文中主要探讨了覆晶封装底胶充填时，锡球、芯片及基板间的流动状况。
6、At the same time, experiments on PBGA solder ball laser reflow were carried out.───同时，本文还对PBGA钎料球激光重熔进行了试验研究。
7、Furthermore, the effect of solder ball layout and stress relax buffer layer material on the fatigue life of solder joints is studied.───最后探测锡球配置方式和缓冲层材料性质对于锡球疲劳寿命的影响，以获得高可靠度的封装结构。
8、The solder ball printing device of the invention comprises a flux printing part for printing flux on an electrode pad of a substrate;───本发明的焊料球印刷装置包括：在基板的电极焊盘上印刷助焊剂的助焊剂印刷部；